7nm 노드에서 대만 반도체가 삼성과 인텔을 상대로 확실한 승자입니다.

Since 2014, when Taiwanese Semiconductor began ramping up production at the 16/20nm node, the company’s global foundry share has risen by more than 50%. By the end of 2020, TSMC had 57% of the global foundry market share, with semiconductors produced at the 14nm node and below accounting for 41% of its revenue.

The reason for TSMC’s decision to keep the 28nm node in short supply is that it has been forced to build a Chinese fab due to the recent external environment, which also explains the justification for its business model to transition to the advanced node.
For 300mm wafers, the total profit is $2,835 for the 28nm node and $8,695 for the 3nm node.

Other competitors are motivated by the significant revenue potential for smaller nodes. Because of US restrictions, Chinese foundries such as SMIC and Hua Hong Semiconductor are currently limited to the 14nm node. Taiwan UMC decided to keep the 14nm and higher node given that most of its foundry customers choose this node.
However, in direct competition with TSMC, Samsung Electronics and Intel are laser-focused on the 7nm node. All three companies have purchased several EUV lithography systems since being one of the early investors in lithography equipment supplier ASML.
The technical aspects of the products of the three companies producing 7nm chips will be determined by the chip design and node transition roadmap.

TSMC
Samsung
For 4nm, TSMC introduced N4P, the third significantly improved iteration of TSMC’s 5nm family in October 2021.

N4P’s efficiency rose 6% faster than N4 and 11% faster than the original N5.
Compared to the N5, the N4P is 22% more efficient in power consumption and has a 6% higher transistor density.

N4P further optimizes the chip manufacturing cycle while reducing process complexity by reducing the amount of photomask layers.

N4P’s efficiency rose 6% faster than N4 and 11% faster than the original N5.

Compared to the N5, the N4P is 22% more efficient in power consumption and has a 6% higher transistor density.

N4P further optimizes the chip manufacturing cycle while reducing process complexity by reducing the amount of photomask layers.
Samsung Foundry has already started mass production of chips based on the 4nm process, and will begin mass production of semiconductors based on 3nm technology in 2022.

Compared to the 5nm EUV process, the company’s 3nm process combines a GAA design with a Multi-Bridge-Channel FET (MBCFET) to reduce package space by up to 35%, increase performance by 30%, or reduce power consumption by up to 50%.

Previously, Samsung Electronics announced that it would introduce 3nm 3GAE 1st generation technology in the first half of 2022.

A new generation of 3nm 3GAP technology focused on high-performance operation will be launched in 2023.

The 2nm 2GAP process will go into production in 2025. The 4nm process is also getting closer to 3nm yields.